For semiconductor devices, thermal resistance is a very important parameter and indicator, is an important factor affecting the performance and stability of semiconductors. If the thermal resistance is too large, then the heat of the semiconductor device can not be dissipated in time, resulting in high temperature of the semiconductor device, resulting in a decline in the performance of the device, or even damage to the device. Therefore, semiconductor thermal resistance test is essential, nano software will take you to understand the thermal resistance test method.

Semiconductor thermal resistance test principle

Thermal resistance refers to the degree of obstruction to heat conduction by electronic devices or materials. Semiconductor thermal resistance refers to the size of resistance to heat transfer in semiconductor devices. Semiconductor thermal resistance is divided into internal thermal resistance and external thermal resistance. Internal thermal resistance is the thermal resistance between the materials inside the device, and external thermal resistance is the thermal resistance between the device and the surrounding environment.

Semiconductor thermal resistance test is to calculate the size of semiconductor thermal resistance by measuring the temperature difference between the two ends of the semiconductor device and projecting the amount of heat generated by the device through the current of the device.

1. Selection of test equipment

Generally use focusing type thermal resistance meter or infrared thermometer, need to choose according to the sample size, measurement range, accuracy and other factors.

2. Prepare the test sample

Add the semiconductor device to be tested on the heat sink to reach thermal equilibrium with the environment.

3. Starting the test

Under certain current-carrying conditions, measure the temperature difference between the two ends of the device using the selected test instrument, and calculate the power and heat generation of the device based on the current and voltage.

4. Calculate thermal resistance

Calculate the thermal resistance of the semiconductor device based on the measured temperature difference and heat generation,semiconductor testing as well as parameters such as the surface area of the device.

1. Hot plate method

The semiconductor device is placed on a constant temperature hot plate and the temperature distribution on the hot plate is measured to calculate the thermal resistance of the semiconductor device. The advantage of this method is that it has high testing accuracy and is suitable for semiconductor devices of various sizes, but the testing cost is high.

2. Heat flow method

The thermal resistance is calculated by measuring the heat flow of the semiconductor device. The semiconductor device is placed in a constant temperature environment and the heat flow and temperature distribution of the semiconductor device are measured to calculate the thermal resistance. The heat flow method is fast and suitable for high volume testing. However, the test equipment used is complicated and the test accuracy is low.

3. Thermal imaging camera method

Thermal imaging camera method is a method to calculate thermal resistance by measuring the temperature distribution on the surface of semiconductor devices. A thermal imaging camera is used to take a picture of the semiconductor device,semiconductor failure analysis and the thermal image is analyzed to calculate the thermal resistance. The thermal imaging camera method is fast and suitable for high volume testing. However, the test equipment is more expensive and the test accuracy is lower.

4. Thermocouple method

Thermocouple method calculates thermal resistance by measuring the temperature distribution of semiconductor devices. The device is placed in a constant temperature environment and the temperature distribution on the surface of the semiconductor device is measured to calculate the thermal resistance. This method has high testing accuracy and is suitable for devices of various sizes, but the testing speed is slow.

5. Thermal resistance tester method

The thermal resistance is calculated by measuring the temperature difference between the two ends of the semiconductor device and the current of the device. During the test, the device needs to be heated to a certain temperature,aotomatic prober and then the temperature and current of the device are measured by the test instrument, so as to calculate the thermal resistance of the device. The thermal resistance tester method has high testing accuracy and is widely used in laboratories, but the testing process is more complicated.

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